JPH0250640B2 - - Google Patents

Info

Publication number
JPH0250640B2
JPH0250640B2 JP60249869A JP24986985A JPH0250640B2 JP H0250640 B2 JPH0250640 B2 JP H0250640B2 JP 60249869 A JP60249869 A JP 60249869A JP 24986985 A JP24986985 A JP 24986985A JP H0250640 B2 JPH0250640 B2 JP H0250640B2
Authority
JP
Japan
Prior art keywords
electronic component
carrier tape
cover
suction tool
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60249869A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62111825A (ja
Inventor
Koichi Asai
Mamoru Tsuda
Yasuo Muto
Shinsuke Suhara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17199398&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0250640(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Priority to JP60249869A priority Critical patent/JPS62111825A/ja
Priority to US06/925,790 priority patent/US4740136A/en
Priority to EP86308620A priority patent/EP0223505B1/en
Priority to DE3650421T priority patent/DE3650421T2/de
Publication of JPS62111825A publication Critical patent/JPS62111825A/ja
Publication of JPH0250640B2 publication Critical patent/JPH0250640B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49819—Disassembling with conveying of work or disassembled work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49821—Disassembling by altering or destroying work part or connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53539—Means to assemble or disassemble including work conveyor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)
  • Specific Conveyance Elements (AREA)
  • Advancing Webs (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
JP60249869A 1985-11-06 1985-11-06 キヤリヤテ−プから電子部品を取り出す方法 Granted JPS62111825A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60249869A JPS62111825A (ja) 1985-11-06 1985-11-06 キヤリヤテ−プから電子部品を取り出す方法
US06/925,790 US4740136A (en) 1985-11-06 1986-10-31 Method and apparatus for taking electronic component out of carrier tape
EP86308620A EP0223505B1 (en) 1985-11-06 1986-11-05 Method and apparatus for taking electronic component out of carrier tape
DE3650421T DE3650421T2 (de) 1985-11-06 1986-11-05 Verfahren und Gerät zum Entfernen elektronischer Bauelemente von einem Trägerband.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60249869A JPS62111825A (ja) 1985-11-06 1985-11-06 キヤリヤテ−プから電子部品を取り出す方法

Publications (2)

Publication Number Publication Date
JPS62111825A JPS62111825A (ja) 1987-05-22
JPH0250640B2 true JPH0250640B2 (en]) 1990-11-02

Family

ID=17199398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60249869A Granted JPS62111825A (ja) 1985-11-06 1985-11-06 キヤリヤテ−プから電子部品を取り出す方法

Country Status (4)

Country Link
US (1) US4740136A (en])
EP (1) EP0223505B1 (en])
JP (1) JPS62111825A (en])
DE (1) DE3650421T2 (en])

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5036571A (en) * 1986-09-25 1991-08-06 Illinois Tool Works, Inc. Carrier tape and cover applying and removal devices for same
JPH0770858B2 (ja) * 1987-01-19 1995-07-31 三洋電機株式会社 部品供給装置
JPS63277166A (ja) * 1987-05-09 1988-11-15 Hitachi Ltd チツプ電子部品供給装置
US4838452A (en) * 1987-11-27 1989-06-13 Universal Instruments Corporation Shutter system for electrical component supply tape feeder
JPH01145898A (ja) * 1987-12-02 1989-06-07 Matsushita Electric Ind Co Ltd 部品供給装置
JPH01182742A (ja) * 1988-01-13 1989-07-20 Mitsubishi Electric Corp 半導体装置の外観検査機
US5044875A (en) * 1988-02-16 1991-09-03 International Business Machines Corporation Method and apparatus for positioning components
US5084962A (en) * 1988-08-24 1992-02-04 Tdk Corporation Apparatus for and method of automatically mounting electronic component on printed circuit board
US4883300A (en) * 1988-10-13 1989-11-28 Intelmatec Corporation End effector for IC chip handling
US5289625A (en) * 1989-04-05 1994-03-01 Canon Kabushiki Kaisha Method for supplying articles and apparatus therefor
US5020959A (en) * 1989-04-14 1991-06-04 Universal Instruments Corporation Adjustable shutter for containment of electrical components in tape feeders
CA2014450A1 (en) * 1989-04-14 1990-10-14 Henry J. Soth Adjustable shutter for containment of small electronics components in tape feeders
US5191693A (en) * 1989-12-29 1993-03-09 Canon Kabushiki Kaisha Tape type work conveying method and conveying apparatus
US5035316A (en) * 1990-01-22 1991-07-30 Universal Instruments Corporation Isolating a first component to be pickup from other components on a vibratory feeder
US5017078A (en) * 1990-01-24 1991-05-21 Molex Incorporated Method and apparatus for unloading components from tape carrier packaging
US5046610A (en) * 1990-01-29 1991-09-10 Christianson Systems, Inc. Electronic component carrier
US5101975A (en) * 1990-10-31 1992-04-07 Novapak, Inc. Electronic component carrier
AU7245891A (en) * 1990-01-29 1991-08-21 Novapak, Inc. Electronic component carrier
TW197380B (en]) * 1990-03-02 1993-01-01 Glaxo Group Ltd
SK280968B6 (sk) 1990-03-02 2000-10-09 Glaxo Group Limited Balenie medikamentu na použite v inhalačnom prístroji
GB9004781D0 (en) * 1990-03-02 1990-04-25 Glaxo Group Ltd Device
US6536427B2 (en) 1990-03-02 2003-03-25 Glaxo Group Limited Inhalation device
JP2767976B2 (ja) * 1990-05-25 1998-06-25 ソニー株式会社 電子部品取出装置
JPH07114319B2 (ja) * 1991-01-22 1995-12-06 松下電器産業株式会社 チップ形電子部品の供給装置
JP3023207B2 (ja) * 1991-05-11 2000-03-21 富士機械製造株式会社 ラチェット装置およびテーピング電子部品送り装置
DE59301873D1 (de) * 1992-09-21 1996-04-18 Siemens Ag Zuführeinrichtung für gegurtete SMD-Bauelemente
JPH077292A (ja) * 1993-06-18 1995-01-10 Toshiba Corp 部品供給装置
US5381508A (en) * 1993-08-25 1995-01-10 Krumenacher; Paul F. Suction and light guide assembly
US5440799A (en) * 1993-12-08 1995-08-15 Molex Incorporated Electrical terminal applicator with improved terminal tape feed means
US5605430A (en) * 1994-02-15 1997-02-25 Zierick Manufacturing Corporation Feeder and method of supplying a continuous strip of surface mount contacts to surface mounting equipment
US5449265A (en) * 1994-02-15 1995-09-12 Zierick Manufacturing Corporation Feeder and method of supplying a continuous strip of surface mount contacts to pick-and-place machine
JP3404431B2 (ja) * 1994-07-04 2003-05-06 富士機械製造株式会社 電子部品供給カートリッジおよび電子部品供給取出装置
JP2666788B2 (ja) * 1995-10-19 1997-10-22 日本電気株式会社 チップサイズ半導体装置の製造方法
US5725140A (en) * 1996-09-09 1998-03-10 Amistar Corporation Tape feeder for a surface mount placement system
US6513563B1 (en) * 1997-01-20 2003-02-04 Matsushita Electric Industrial Co., Ltd. Component feeding method and device
US6082954A (en) 1997-02-21 2000-07-04 Summit Holding Two, Inc. Tape feeders and systems using the same
JP3935579B2 (ja) * 1997-10-29 2007-06-27 富士機械製造株式会社 カバーテープ送り装置，カバーテープ処理装置およびフィーダユニット
JP4117859B2 (ja) * 1998-06-24 2008-07-16 富士機械製造株式会社 部品供給ユニット
US6162007A (en) * 1999-01-14 2000-12-19 Witte; Stefan Apparatus for feeding electronic component tape
DE60037945D1 (de) * 1999-11-05 2008-03-20 Matsushita Electric Ind Co Ltd Teilezuführmethode und vorrichtung und damit ausgerüstete bestückungseinrichtung
JP2003341782A (ja) * 2002-05-27 2003-12-03 Oki Electric Ind Co Ltd 電子デバイス収容体、電子デバイスの搬送方法、電子デバイスの実装方法、電子デバイスの収容方法
US20080113532A1 (en) * 2006-11-13 2008-05-15 David Christopher Smeltz Pick-and-place card guide clip-on grounding members
EP1956879A1 (en) * 2007-02-09 2008-08-13 ASUSTeK Computer Inc. Feeder cover
JP5136552B2 (ja) * 2007-06-13 2013-02-06 富士通株式会社 キャリアテープから電子部品を取り出す方法
US8337219B2 (en) 2011-02-19 2012-12-25 Laird Technologies, Inc. Card guide grounding strips
EP2695505B1 (en) * 2011-04-08 2018-09-19 Mycronic AB Tape feeder and method for moving a carrier tape towards a picking position in a component mounting machine
NL2012876B1 (en) * 2014-05-23 2016-03-15 Ics Solutions B V Apparatus for thermally processing food packages comprising product carriers with positive package handling.
US10772247B2 (en) * 2015-06-18 2020-09-08 Fuji Corporation Tape cutting processing apparatus and processing method
JP6684893B2 (ja) * 2016-03-08 2020-04-22 株式会社Ｆｕｊｉ 部品取出方法
CN109514761B (zh) * 2019-01-09 2023-10-13 上汽大众汽车有限公司 防漏投料器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH318102A (fr) * 1954-06-08 1956-12-15 Sapal Plieuses Automatiques Procédé pour l'emballage d'articles, notamment d'articles alimentaires
US3906614A (en) * 1974-07-18 1975-09-23 Illinois Tool Works Method of loading radial lead components on plastic carrier
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS55118698A (en) * 1979-03-05 1980-09-11 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS57140000A (en) * 1981-02-23 1982-08-30 Matsushita Electric Ind Co Ltd Electronic part supplying device
JPS57148875A (en) * 1981-03-11 1982-09-14 Shin Kobe Electric Mach Co Ltd Production of lattice for plate of lead storage battery
NL8103573A (nl) * 1981-07-29 1983-02-16 Philips Nv Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie.
JPS60152100A (ja) * 1984-01-20 1985-08-10 松下電器産業株式会社 電子部品供給装置
JPS6189435A (ja) * 1984-10-05 1986-05-07 Tooshin Reinetsu:Kk 厨房用油除去装置

Also Published As

Publication number Publication date
EP0223505B1 (en) 1995-10-18
JPS62111825A (ja) 1987-05-22
DE3650421T2 (de) 1996-04-04
EP0223505A2 (en) 1987-05-27
US4740136A (en) 1988-04-26
EP0223505A3 (en) 1989-04-26
DE3650421D1 (de) 1995-11-23

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